AI Chip Equipment

Semiconductor Equipment Market Share by Segment

Who sells the multi-million-dollar machines inside every chip fab. Lithography prints circuit patterns (ASML monopoly); etch and deposition carve and lay down material (Applied, Lam, Tokyo Electron); inspection checks for defects (KLA).

Lithography

$28B TAM
ASML
82%
Canon
10%
Nikon
8%

Etch Systems

$18.5B TAM
Lam Research
47%
Tokyo Electron
27%
Applied Materials
20%
Others
6%

Deposition (CVD/PVD)

$22B TAM
Applied Materials
40%
Lam Research
22%
Tokyo Electron
20%
ASM International
12%
Others
6%

Inspection & Metrology

$12B TAM
KLA
55%
Applied Materials
18%
Hitachi
12%
Others
15%

ASML EUV Lithography Shipments & Revenue

Annual shipments and revenue of EUV (Extreme Ultraviolet) lithography systems from ASML, the only company on Earth that makes them. Each machine costs $150M–$380M+ (the newer High-NA variant), and no advanced AI chip can be built without one.
EUV Systems Shipped (left axis)
EUV Revenue $B (right axis)

WFE Revenue + Order Book by Vendor (Quarterly)

Quarterly revenue of the Big 5 wafer-fab-equipment vendors (ASML, AMAT, LRCX, KLA, Tokyo Electron), who together hold ~85% of WFE spending.

WFE Revenue by Region + Customer Concentration (FY2024)

FY2024 wafer-fab-equipment revenue for the Big 5 vendors, split by customer region. China is the largest single-region exposure (~30-40%).

ASML Net Sales: Systems vs Installed Base

ASML net sales in euro billions: implied system sales (total minus Installed Base Management) stacked with IBM. IBM is service and field options on the installed lithography fleet. Q2 2026 total net sales were EUR 9.3 billion.

ASML System Sales: Logic vs Memory

ASML net system sales split between Logic and Memory, only for quarters where ASML stated the split. Memory rose from 30% in 4Q25 to 49% in 2Q26 as DRAM and HBM-related capex caught up with leading-edge logic.

ASML High-NA EUV Status

High-NA EUV (EXE) milestones as stated by ASML. High-NA is still single-digit systems per year. Low-NA NXE remains the volume EUV tool (about 65 planned for 2026).
WhenASML statementImplication
FY2025Shipped a total of eight High-NA systems to several customers; six in operation, including the first second-generation EXE:5200B meeting full specs at a customer siteInstalled base is still a handful of tools, not a High-NA production fleet
Q4 2025Revenue recognized on two High-NA systems, including the first EXE:5200B after site acceptanceHigh-NA is now in the P&L, not only in shipments
Q2 2026EUV system sales of EUR 3.8 billion included sales of one High-NA system. Full-year 2026 Low-NA EUV capacity around 65 tools. Four to five High-NA systems expected to achieve revenue recognition in 2026 (Q2 prepared remarks)Low-NA remains the volume EUV product; High-NA is still single-digit units
Intel 18AASML and Intel stated Intel Foundry is using High-NA EUV at Intel 18A for some Core Ultra Series 3 processorsFirst named high-volume logic insertion; does not mean High-NA is in every 18A layer

Applied Materials Semiconductor Systems Mix

Applied Semiconductor Systems revenue mix. DRAM rose to 26% of the segment in fiscal Q3 2026 from 22% a year earlier, while the segment itself grew from $5.56B to $7.04B. Prior-year mix is recast for the FY2026 presentation.

SEMI Worldwide Equipment Billings

SEMI worldwide semiconductor equipment billings, USD billions. Full-year 2025 was $135.1B, up 15% from $117.1B in 2024. Q1 2026 printed $36.55B, up 14% year on year.

SEMI Equipment Billings by Region

SEMI WWSEMS regional equipment billings in USD billions from the Q1 2026 regional table (which also restates Q4 2025 and Q1 2025). China remained largest in 1Q26 at $10.99B but fell 16% quarter on quarter.

US AI Chip and Tool Export Controls

Official BIS rules on advanced AI chips and semiconductor manufacturing equipment, 2022 to 2026. This is a legal timeline, not an estimate of lost sales. License posture on individual SKUs has changed more than once since 2024.
DateAgency actionWhat it covers
2022-10-07BIS interim final ruleFirst comprehensive controls on advanced computing ICs, supercomputer end uses, and semiconductor manufacturing equipment destined for the PRC, with U.S. person restrictions on supporting certain PRC fabs
2023-10-17BIS updates to the 2022 IFRTightened advanced-computing performance thresholds, closed some transshipment paths, and expanded manufacturing-equipment controls, including additional tools used at leading-edge nodes
2024-2026Follow-on BIS licensing and Entity List actionsProduct-specific licenses (including NVIDIA H20-class parts at various times) and Entity List additions sit on top of the 2022-2023 rules. License posture has changed more than once; read the current BIS notice rather than assuming a permanent ban or a permanent approval
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AI Chip Equipment: Market Data | Sterling