AI Chip Foundries
Foundry Revenue by Company
Process Node Status by Foundry
| Foundry | 7nm / N7 | 5nm / N5 | 4nm / N4 | 3nm / N3 | 2nm / N2 |
|---|---|---|---|---|---|
 TSMC | Mass ProductionHVM: 201814% of rev | Mass ProductionHVM: 202035% of rev | Mass ProductionHVM: 2022 | Mass ProductionHVM: 202228% of rev | RampingHVM: 2025 Q4 |
 Samsung | Mass ProductionHVM: 201920% of rev | Mass ProductionHVM: 202125% of rev | Mass ProductionHVM: 202230% of rev | Mass ProductionHVM: 202410% of rev | In DevelopmentHVM: Late 2025 |
 Intel Foundry | Mass ProductionHVM: 2021 (Intel 4)30% of rev | Mass ProductionHVM: 2024 (Intel 3)15% of rev | CancelledHVM: Cancelled (Intel 20A) | Risk ProductionHVM: H2 2025 (Intel 18A) | In DevelopmentHVM: 2027 (Intel 14A) |
Global Fab Locations
TSMC
6 facilitiesHsinchu, Taiwan
HQ and primary R&D center: N2 volume production and A16 planned H2 2026
Tainan, Taiwan
Fab 18: world's first 3nm mass production facility, major 2nm expansion planned
Kaohsiung, Taiwan
2nm volume production began Q4 2025: NT$1.5T investment, 6 phases planned by end 2027
Phoenix, Arizona
Fab 1 (N4) operational Q4 2024. 6 fabs planned totaling $165B: Fab 2 N3 by 2027, Fab 3 N2/A16 by end of decade
Kumamoto, Japan
JASM joint venture: operational since Dec 2024. Phase 2 (6nm) under construction, expected 2027
Dresden, Germany
ESMC joint venture: equipment move-in H2 2026, production late 2027
Samsung
4 facilitiesHwaseong, South Korea
Largest Samsung fab complex: 3nm GAA production, first High-NA EUV arrived March 2025
Pyeongtaek, South Korea
World's largest semiconductor campus: P4 converting to 1c DRAM
Taylor, Texas
92% complete: delayed to mass production early 2027 (from 2024). Tesla as anchor customer via $16.5B long-term contract
Austin, Texas
Operational on mature nodes: contributing $19.8B to local economy
Intel
4 facilitiesHillsboro, Oregon
D1X: $36B investment, R&D hub, High-NA EUV assembly completed
Chandler, Arizona
Fab 52: 18A mass production beginning 2025, 15 EUV machines planned
Leixlip, Ireland
Fab 34: Intel 4 production since Sept 2023, Intel 3 shifting to HVM 2025
New Albany, Ohio
$28B fab complex: delayed to 2030-2031 (5-year delay from original plan)
SK Hynix
3 facilitiesIcheon, South Korea
HQ: 12-layer HBM mass production since Sept 2024, 130K units/month
Cheongju, South Korea
M15X: cleanroom opened Oct 2025, commercial production Feb 2026, KRW 20T+ investment
West Lafayette, Indiana
$3.87B advanced packaging facility: groundbreaking March 2025, mass production H2 2028
Micron
3 facilitiesBoise, Idaho
$15B new fab (ID1) under construction, wafer output H2 2027. $30B second fab (ID2) also announced
Hiroshima, Japan
1-gamma DRAM and EUV production. New HBM fab: JPY 1.5T (~$9.6B), HBM shipments ~2028
Clay, New York
Groundbreaking March 2026: Fab 1 operations Q3 2030 (2-year delay). Up to $100B over 20+ years
Advanced Packaging Capacity (CoWoS-Equivalent Wafers per Month)
TSMC Wafer Revenue Mix by Node
TSMC Revenue Mix by Platform
TSMC Revenue Mix by Customer Geography
Intel Products vs Intel Foundry
CHIPS Act Direct Funding Awards
| Recipient | Direct funding (up to) | Stated private investment | Sites | What it funds |
|---|---|---|---|---|
| TSMC Arizona | $6.6B | > $65B | Phoenix, AZ (three leading-edge fabs) | Leading-edge logic cluster in Arizona; disbursed on construction and production milestones |
| Intel | $7.865B | Nearly $90B U.S. by end of decade | Arizona, New Mexico, Ohio, Oregon | Leading-edge capacity expansion under Intel Foundry |
| Samsung Electronics | $4.745B | > $37B | Taylor and Austin, TX | Two leading-edge logic fabs and an R&D fab in Taylor, plus Austin expansion |
| Micron | $6.165B | ~$100B NY and $25B ID over two decades (company vision) | Idaho and New York (plus $275M proposed for Manassas, VA) | Advanced DRAM manufacturing; first step of a multi-decade U.S. memory build |
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