AI Chips
AI Chip Memory
HBM Industry Revenue Growth
Total quarterly revenue across all HBM (High-Bandwidth Memory) suppliers. Up roughly 20x since early 2022 because every AI accelerator now ships with 80–192 GB of stacked DRAM, making HBM the highest-margin memory product in the industry.
Industry DRAM and NAND Contract ASP
Commodity memory contract prices (index, Q1 2022 = 100). The 2023 trough and 2026 squeeze are the cycle sitting next to HBM: suppliers reallocated wafers to HBM and server DRAM, and conventional DRAM plus NAND contract ASP went vertical. This is not HBM pricing and not Sandisk's one-print ASP table.
HBM Generation Comparison
How each HBM (High-Bandwidth Memory) generation compares on bandwidth, capacity per stack, layer count, and which AI chips use it. HBM3E is the volume product today (NVIDIA H200, B100); HBM4 begins shipping in late 2025 with roughly 2x the bandwidth.
| Generation | Year | Bandwidth | Capacity/Stack | Layers | TSV Pitch | Used In | Status |
|---|---|---|---|---|---|---|---|
| HBM2 | 2018 | 256 GB/s | 8 GB/stack | 8-Hi | ~40 μm | NVIDIA V100AMD MI60 | Legacy |
| HBM2E | 2020 | 460 GB/s | 16 GB/stack | 8-Hi | ~36 μm | NVIDIA A100Intel Gaudi 2 | Mature |
| HBM3 | 2022 | 665 GB/s | 24 GB/stack | 12-Hi | ~30 μm | NVIDIA H100AMD MI300X | Mass Production |
| HBM3E | 2024 | 1.18 TB/s | 36 GB/stack | 12-Hi | ~26 μm | NVIDIA B200AMD MI325X | Mass Production |
| HBM4 | 2025–2026 | 2.0 TB/s | 48 GB/stack | 16-Hi | ~20 μm | NVIDIA Rubin (expected)AMD MI400 (expected) | Sampling |
| HBM4E | 2026–2027 | 3.25 TB/s | 64 GB/stack | 16-Hi | ~18 μm | Next-gen AI accelerators | Development |
HBM Bit Shipments by Supplier (Quarterly)
Quarterly HBM bit shipments across SK Hynix, Samsung, Micron in petabits. SK Hynix dominates from NVDA HBM3E first-mover qualification; Samsung NVDA HBM3E qualification partial; Micron ramping HBM3E + HBM4.
HBM3E + HBM4 Qualification Status by Customer
Qualification matrix: rows are HBM suppliers, columns are customer platforms (NVIDIA, AMD, Google TPU). SK Hynix's first-mover NVIDIA HBM3E qualification is the marquee milestone.
| Supplier | NVDA H200 (HBM3E) | NVDA B100/B200 (HBM3E) | NVDA Rubin (HBM4) | AMD MI300/325 (HBM3E) | AMD MI350/400 (HBM4) | Google TPU (HBM3E + HBM4) | |
|---|---|---|---|---|---|---|---|
| SK Hynix | Qualified (sole supplier 2024-H1; volume ramp Q2-Q3 2024) | Qualified (volume ramp Q4 2024 onward) | Sampling + qualifying (Q1-Q2 2026); targeting volume H2 2026 | Qualified (volume ramp Q3 2024 onward) | Sampling + qualifying; targeting volume late 2026 | Qualified (TPU v5e + v6e); HBM4 sampling for v7 | |
| Samsung | Partial qualification Q4 2024 (limited volumes); full status disputed in trade press | Partial qualification; NVDA Q1 2026 reportedly accepted some HBM3E volumes | Sampling (Q1 2026); qualification timing uncertain | Qualified (alternate source to SK Hynix for MI300X + MI325X) | Sampling + qualifying; competitive with SK Hynix | Qualified for TPU v6e + v7 (Google Samsung HBM3E supplier) | |
| Micron | Qualified Q3 2024 (NVDA validated; production ramp from late 2024) | Qualified Q4 2024 (production ramp continuing through 2025) | Sampling Q1 2026; volume target H2 2026 | Not engaged at material volume (SK Hynix + Samsung sources) | Sampling; emerging as third source | Limited engagement; not a primary Google supplier | |
| Editorial. Why this matters | Qualification is the gating event for HBM revenue. SK Hynix first-mover NVDA qualification is the marquee 2024 industry milestone. The Samsung HBM3E NVDA qualification timing is the most-watched cross-supplier comparison in memory. Micron's catch-up qualification is the marquee 2024-2025 turnaround story. |
Micron DRAM vs NAND Revenue
Micron revenue by technology from the fiscal Q3 2026 presentation. DRAM includes HBM. Only quarters with a technology table in the cited materials are shown. Fiscal Q3 2026 ended May 28, 2026.
SK hynix Revenue and Operating Margin
SK hynix consolidated results in KRW from company newsroom figures. Q2 2026 revenue was KRW 79.3 trillion with a 76% operating margin. Won is used so FX conversion does not flatten the sequential move. The company said mass shipments of HBM4 began in Q2 2026.
Supplier-Stated HBM Figures
HBM figures the suppliers themselves stated in earnings materials. TrendForce or Counterpoint share estimates are excluded here; those belong on the HBM market-share chart.
| Date | Company | Disclosure | What it is not |
|---|---|---|---|
| FY2024 | Micron | First material HBM revenue; subsequent commentary put full-year HBM around $1B | Not a quarterly GAAP line item; HBM sits inside DRAM |
| FQ3 FY2025 (Jun 2025 call) | Micron | Year-to-date HBM revenue passed $5B | Not a single-quarter print |
| FQ4 FY2025 (Sep 2025 remarks) | Micron | HBM nearly $2B in the quarter | Company said 'nearly $2B', not an audited segment |
| FQ3 FY2026 (Jun 2026 remarks) | Micron | HBM4 shipped revenue already exceeded $1B; HBM4 in high-volume shipments for the lead customer | Does not disclose remaining HBM3E revenue in the same quarter |
| 2Q26 (Jul 2026 newsroom) | SK hynix | Began mass shipments of HBM4 in Q2 2026; will ramp in the second half. HBM4E sample shipments completed in H1 2026 | No HBM revenue dollar figure was disclosed for the quarter |
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