HBM Industry Revenue Growth
Total quarterly revenue across all HBM (High-Bandwidth Memory) suppliers. Up roughly 20x since early 2022 because every AI accelerator now ships with 80–192 GB of stacked DRAM, making HBM the highest-margin memory product in the industry.
Updated at 2026-05-06
HBM Generation Comparison
How each HBM (High-Bandwidth Memory) generation compares on bandwidth, capacity per stack, layer count, and which AI chips use it. HBM3E is the volume product today (NVIDIA H200, B100); HBM4 begins shipping in late 2025 with roughly 2x the bandwidth.
| Generation | Year | Bandwidth | Capacity/Stack | Layers | TSV Pitch | Used In | Status |
|---|---|---|---|---|---|---|---|
| HBM2 | 2018 | 256 GB/s | 8 GB/stack | 8-Hi | ~40 μm | NVIDIA V100AMD MI60 | Legacy |
| HBM2E | 2020 | 460 GB/s | 16 GB/stack | 8-Hi | ~36 μm | NVIDIA A100Intel Gaudi 2 | Mature |
| HBM3 | 2022 | 665 GB/s | 24 GB/stack | 12-Hi | ~30 μm | NVIDIA H100AMD MI300X | Mass Production |
| HBM3E | 2024 | 1.18 TB/s | 36 GB/stack | 12-Hi | ~26 μm | NVIDIA B200AMD MI325X | Mass Production |
| HBM4 | 2025–2026 | 2.0 TB/s | 48 GB/stack | 16-Hi | ~20 μm | NVIDIA Rubin (expected)AMD MI400 (expected) | Sampling |
| HBM4E | 2026–2027 | 3.25 TB/s | 64 GB/stack | 16-Hi | ~18 μm | Next-gen AI accelerators | Development |
Updated at 2026-03-18
HBM Bit Shipments by Supplier (Quarterly)
Quarterly HBM bit shipments across SK Hynix, Samsung, Micron in petabits. SK Hynix dominates from NVDA HBM3E first-mover qualification; Samsung NVDA HBM3E qualification partial; Micron ramping HBM3E + HBM4.
Updated at 2026-05-31
HBM3E + HBM4 Qualification Status by Customer
Qualification matrix: rows are HBM suppliers, columns are customer platforms (NVIDIA, AMD, Google TPU). SK Hynix's first-mover NVIDIA HBM3E qualification is the marquee milestone.
| Supplier | NVDA H200 (HBM3E) | NVDA B100/B200 (HBM3E) | NVDA Rubin (HBM4) | AMD MI300/325 (HBM3E) | AMD MI350/400 (HBM4) | Google TPU (HBM3E + HBM4) | |
|---|---|---|---|---|---|---|---|
| SK Hynix | Qualified (sole supplier 2024-H1; volume ramp Q2-Q3 2024) | Qualified (volume ramp Q4 2024 onward) | Sampling + qualifying (Q1-Q2 2026); targeting volume H2 2026 | Qualified (volume ramp Q3 2024 onward) | Sampling + qualifying; targeting volume late 2026 | Qualified (TPU v5e + v6e); HBM4 sampling for v7 | |
| Samsung | Partial qualification Q4 2024 (limited volumes); full status disputed in trade press | Partial qualification; NVDA Q1 2026 reportedly accepted some HBM3E volumes | Sampling (Q1 2026); qualification timing uncertain | Qualified (alternate source to SK Hynix for MI300X + MI325X) | Sampling + qualifying; competitive with SK Hynix | Qualified for TPU v6e + v7 (Google Samsung HBM3E supplier) | |
| Micron | Qualified Q3 2024 (NVDA validated; production ramp from late 2024) | Qualified Q4 2024 (production ramp continuing through 2025) | Sampling Q1 2026; volume target H2 2026 | Not engaged at material volume (SK Hynix + Samsung sources) | Sampling; emerging as third source | Limited engagement; not a primary Google supplier | |
| Editorial. Why this matters | Qualification is the gating event for HBM revenue. SK Hynix first-mover NVDA qualification is the marquee 2024 industry milestone. The Samsung HBM3E NVDA qualification timing is the most-watched cross-supplier comparison in memory. Micron's catch-up qualification is the marquee 2024-2025 turnaround story. |
Updated at 2026-05-28